Renesas Electronics Corporation
10000+ employees
Semiconductors
Electronics
Technology
About Renesas Electronics Corporation
Renesas Electronics Corporation is a leading global supplier of advanced semiconductor solutions, specializing in microcontrollers, analog, power, and SoC products. The company serves a wide range of markets including automotive, industrial, infrastructure, and IoT applications. Renesas is committed to innovation and delivering high-quality, reliable semiconductor products that enable smarter, safer, and more efficient technologies worldwide. With a strong focus on R&D and customer collaboration, Renesas aims to drive the future of embedded systems and digital transformation.
4 days ago
Staff Engineer
Full-time
Lead
Staff Engineer
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Description
- We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group.
- Essential Functions: Highly experienced in board and package design from block level to final board and package delivery.
- Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release.
- Must be a natural team player and strive towards fostering a highly creative and productive working environment.
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Requirements
- MTech/BTech in EC/EE/CS with hardware engineering experience of 7 to 10 years.
- Experience in Microcontroller and Microprocessor based complex design.
- Experience in latest packaging Technologies and Manufacturing process.
- Strong domain knowledge of system clocking, system modes, power management, debug.
- Board level System architecture and design includes memory or communication interfaces.
- SOC specifications and board level system specifications.
- Development and design of SOC power supply, system power supply specifications, and PMIC specifications.
- Interface specifications incorporating SOC-peripheral devices.
- Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory.
- Board level DC/AC simulations.
- Schematic, Layout and BOM generation using modern CAD tools.
- Experience with SoC Bring-up activities.
- Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process.
- Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D.
- Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging.
- Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity.
- Thermal simulation experience is added advantage.
- Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes.
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL.
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Benefits
- Flexible and inclusive work environment.
- Opportunities to explore hardware and software capabilities.
- Employee Resource Groups for support.
- Remote work option.